[25-N5] Demonstration of use of CAE (MBD) for thermal and electronic circuits in EV models, carbon neutral and mass production designs
planning committee
Model-based Development Technology Technical Committee based on International Standard Description
Theme
Utilizing and demonstrating CAE (MBD) for thermal and electronic circuits in EV models, carbon neutral and mass production designs
Date
Friday, January 2025, 7 18:10-00:13
Recommended participation
For the practical application of CAE and MBD, including vehicle electrification and carbon neutral and heat-conscious electronic circuits, it is important to develop and distribute models based on the international standard description model language VHDL-AMS, which ensures compatibility. This forum aims to support CAE and MBD, including electric vehicle models, as a technology that promotes cloud-based collaboration and innovation among companies. This forum is ideal for those who are interested in promoting CAE and MBD through the use of model creation methods and their verification methods that enable collaboration with OEM-Tier1-Tier2, and engineers (including mass production design engineers!) who want to learn the methods from basics to applications through practical examples.
Program
| Start time | ending time | role | A topic | Name | Work |
|---|---|---|---|---|---|
| 10:00 | 10:00 | Greetings | Opening Remarks | Mr. Junichi Ichihara | Chairman of the Technical Committee for Model-Based Development Technology Using International Standard Descriptions / AZAPA Co., Ltd. |
| - | - | Moderator | Mr. Hideto Noyama | Mitsubishi Heavy Industries Thermal Systems Co., Ltd. | |
| 10:00 | 10:10 | Lecture | Simulation setup for digital authentication protocol | Mr. Toshitsugu Kato | Doshisha University |
| 10:10 | 10:25 | Lecture | Initiatives for Virtual Testing Using Digital Twins and Digital Certification II | Mr. Koji Tsuji | Digital Twins Co., Ltd. |
| 10:25 | 10:35 | Lecture | Consideration and proposal of model traceability using cryptographic hash functions | Mr. Masahiro Okamura | JSOL Co., Ltd. |
| 10:35 | 10:50 | Lecture | Study and proposal on OCC of automotive glass using EV vehicle model (Part 2) POC of Digital Authentication Protocol with EV Cabin Thermal Model |
Mr. Tsunehiro Saito | AGC Inc. |
| 10:50 | 11:00 | Lecture | Predicting the mutual impact of CN (Carbon Neutral) due to design changes of inverters and motors in electrified vehicles | Mr. Ken Iwatsuki | Aisin Co., Ltd. |
| 11:00 | 11:30 | panel discussion | Virtual testing using digital twins and digital authentication initiatives using it | ||
| moderator | Carbon Neutrality and Security Panel Discussion | Mr. Hideto Noyama | Mitsubishi Heavy Industries Thermal Systems Co., Ltd. | ||
| panelist | Mr. Toshitsugu Kato | Doshisha University | |||
| panelist | Mr. Koji Tsuji | Digital Twins Co., Ltd. | |||
| panelist | Mr. Masahiro Okamura | JSOL Co., Ltd. | |||
| panelist | Mr. Tsunehiro Saito | AGC Inc. | |||
| panelist | Mr. Ken Iwatsuki | Aisin Co., Ltd. | |||
| 11:30 | 11:40 | 【rest】 | |||
| - | - | Moderator | - | Mr. Osamu Seya | TechnoPro Inc. TechnoPro Design |
| 11:40 | 11:55 | Lecture | Accuracy verification of circuit analysis method by collaboration between Tier 1 and Tier 1 suppliers using electromechanical coupled 2D model | Mr. Shiho Arimoto | Astemo Corporation |
| 11:55 | 12:10 | Lecture | Gate drive IC circuit model (applied to actuator drive circuits) for system development of in-vehicle electronic devices | Mr. Hideki Jonoguchi | Nagoya Institute of Technology |
| 12:10 | 12:20 | Lecture | Explanation and demonstration of MBD accuracy verification project | Mr. Masashi Inaba | DENSO Corporation |
| Ms. Yoshiko Ikeda | Toshiba Electronic Devices & Storage Corporation | ||||
| 12:20 | 12:30 | Lecture | Electrical circuit-thermal MBD simulation introduction and demo using PartQuest Explore | Mr. Masao Ueda | Siemens EDA Japan Co., Ltd. |
| 12:30 | 13:00 | panel discussion | MBD model accuracy verification simulation and actual equipment measurement project | ||
| moderator | Mr. Haruki Takei | Siemens Corporation | |||
| panelist | Mr. Takuya Shinoda | DENSO Corporation | |||
| panelist | Mr. Takao Egami | AC Technologies Co., Ltd. | |||
| panelist | Mr. Yoshinori Ariga | KOA Co., Ltd. | |||
| panelist | Mr. Taisaku Mukaiyama | Rubicon Co., Ltd. | |||
| panelist | Mr. Takafumi Okumura | Toyota Motor Corporation | |||
| 13:00 | 13:00 | Greetings | closing words | Mr. Osamu Seya | TechnoPro Inc. TechnoPro Design |
Introduction video The planning committee has created a video, so please take a look.
Registration
[Forum NAGOYA] is “Automotive Engineering Exposition2025 NAGOYA” will be held together. To apply for participation, you must register as an exhibition visitor.
・Please apply together with your visitor registration via the "Automotive Engineering Exposition 2025 NAGOYA" website below.
・You can select and apply for the sessions you want to participate in.
About the forum text
Price
| Membership type | Sales at the tournament venueOn September 1, XNUMX, Print version | On sale after the tournamentOn September 2, XNUMX, Electronic data version |
|---|---|---|
| Member | 3,300 JPY (TAX+)On September 3, XNUMX, / 1 volume | 3,520 yen (tax included) / 1 book |
| General | 4,400 yen (tax included) / 1 book |
- *1 The booklet version will be sold only at the venue during the tournament. It will be available at a special price during the tournament.
- *2 After the conference, only the electronic version will be available for purchase through our website/literature information search system.
- *3 During the tournament, tickets can be purchased at the same price regardless of membership status.
